化学機械研磨（CMP）パッド市場調査レポート-最新動向、成長機会、市場規模・シェア世界予測分析-2025年～2035年

Chemical Mechanical Polishing (CMP) Pads Market Size Research Report - Overview

According to a research report on the global Chemical Mechanical Polishing (CMP) Pads market , the market is expected to grow at a CAGR of 7.9 % from 2025 to 2035, generating a market size of USD 7.9 billion by the end of 2035. In 2024, the market size was USD 4.1 billion .

• The global chemical mechanical polishing (CMP) pads market is expected to grow due to the growth of the semiconductor industry.
• The growth of the chemical mechanical polishing (CMP) pads market in Japan is attributed to the development of cutting-edge technologies.
• KDMI analysts' growth analysis predicts that high manufacturing costs will be a challenge to market growth.
• Asia Pacific (APAC), with the highest market share in the chemical mechanical polishing (CMP) pads market, is projected to dominate the global market.

Chemical Mechanical Polishing (CMP) Pads Market Analysis

Chemical Mechanical Polishing (CMP) pads are a type of consumable used in semiconductor manufacturing to finish the flat surface of wafers to be ultra-smooth. The semiconductor industry has become a major user of CMP pads due to its expanding applications in smartphones, car electronics, IoT devices, AI technology, and more. The growth of the global semiconductor industry is driving the need for more precise and efficient CMP pads, which ultimately expands the CMP pads market. According to the Semiconductor Industry Association (SIA), global semiconductor sales in October 2024 will be $56.9 billion, up 22.1% from $46.6 billion in October 2023. Lapmaster Wolters GmbH, LAM Research Corporation, and Cabot Microelectronics Corporation are some of the key players in the global chemical mechanical polishing (CMP) pads market.

Analysts' Views on Japan Chemical Mechanical Polishing (CMP) Pad Market Research

In Japan, the growth of the Chemical Mechanical Polishing (CMP) pads market is attributed to the development of advanced technologies. Increasingly advanced technologies like high performance computing, state-of-the-art packaging methods, and AI (artificial intelligence) are taking Japan to new heights, which is ultimately propelling the CMP pads market forward. In the International Institute for Management Development (IMD) Digital Competitiveness Ranking (2023), Japan ranks 8th overall in the Asia-Pacific region, which indicates that Japan is encouraging and investing in research and development (R&D) in digitalization and new technologies. Furthermore, technological advancements such as semiconductor miniaturization are creating a need for more precise and effective CMP pads, boosting the growth of the overall CMP pads market. Hubei Dinglong, Fujibo, and Hitachi Chemical are some of the key players in the CMP pads market in Japan.

Chemical Mechanical Polishing (CMP) Pad Market Growth Drivers and Challenges

Market growth drivers

Increasing adoption of packaging technologies:

Packaging technology is a key factor in the semiconductor manufacturing industry that affects product performance, performance, and price. Today, the adoption of packaging technologies such as 3DE IC, through silicon via (TSV), and fan-out wafer-level package (FOWLP) is increasing, which calls for advanced CMP polishing and surface preparation solutions. Chemical Mechanical Polishing (CMP) pads are necessary for advanced packaging processes with smooth polishing, surface irregularities, and defects. According to a survey, the semiconductor packaging materials market is estimated to cover US$22 billion worldwide in 2023 and reach approximately US$28 billion in 2028 with a compound annual growth rate of 5.6%. It is also predicted that the global market will exceed US$26 billion by 2025, with a compound annual growth rate (CAGR) of 5.6% until 2028.

Obstacles and Market Challenges

High manufacturing costs:

One of the major obstacles in the Chemical Mechanical Polishing (CMP) pads market is the high cost and complexity involved in manufacturing CMP equipment and consumables, such as slurries, pads, and conditioning tools. Also, cutting-edge equipment such as semiconductor nodes are expensive. Research findings show that the cost of consumables (CoC) dominates the cost of ownership (CoO), with pad and slurry costs typically accounting for more than 60%. Therefore, the overall high cost may hinder the adoption of CMP consumables, especially by smaller manufacturers and new entrants, and hinder the development of the CMP pads market.

Chemical Mechanical Polishing (CMP) Pads Market Segmentation

Experts at KD Market Insights have segmented the Global Chemical Mechanical Polishing (CMP) Pads Market research report into:

Chemical Mechanical Polishing (CMP) Pads Market Regional Overview

The chemical mechanical polishing (CMP) pads market in Asia Pacific (APAC) is driven primarily by increasing investments in the semiconductor manufacturing industry and the expansion of the home electronics sector. On a global scale, Asia Pacific is the hub of semiconductor manufacturing, including countries such as Japan, Taiwan, China, and South Korea. China is the top manufacturer, purchasing more than 50% of the chips manufactured in the world. Strong investments from China in the semiconductor capital equipment sector have contributed to the thriving CMP pads market in the region. According to the report, around 55% of global semiconductor patent applications in 2021-2022 originated in China, with the number of Chinese applications being twice that of the United States, while Chinese companies surpassed US and Japanese companies in semiconductor patents granted in 2022.

North America is the fastest growing region in the CMP pad market. This is due to the advancing research in chip technology, thriving optical industry, increasing demand for higher performance, and the need for finer feature sizes. In addition, the increasing demand for chip manufacturing is driving increased semiconductor production and technological innovation in many countries. According to reports, the US government implemented the landmark CHIPS and Science Act to provide much-needed investment in semiconductor research and manufacturing, strengthening the US economy, national security, and supply chain. In addition, high technologies such as cloud computing, autonomous vehicles, and artificial intelligence, which ultimately improve the precision and reliability of chips, are also contributing to the rapid expansion of the market.

According to analysts at KD Market Insights, the following five companies are driving growth in the Asia Pacific (PAC) chemical mechanical polishing (CMP) pads market:

• Cabot Microelectronics
• Merck Group
• Solvay SA
• Entegris Inc.
• Logitech International SA

Competitive Landscape of Chemical Mechanical Polishing (CMP) Pads Market

The following are the major players with the largest share in the global Chemical Mechanical Polishing (CMP) Pads market:

• 3M
• DuPont Co., Ltd.
• Fujibo Holdings
• Pyrion
• SK Empulse